Compound Semiconductor™ is an Angel Business Communications publication.

A new R&D development designed to support the growth of semiconductor packaging has received a £9 million funding injection, ...

The offering of fully decommissioned, ready-to-ship manufacturing assets from Endicott-based Ubiquity Solar—with nearly 600 ...

Nexperia has introduced a range of industrial grade 1200 V SiC MOSFETs in surface-mount (SMD) top-side cooled packaging ...

Texas Instruments (TI) has announced new power chips to support the rapidly growing power needs of modern data centres, which ...

Now, a research team, led by Masato Kotsugi from the Department of Material Science and Technology at Tokyo University of ...

Mitsubishi Electric Corporation will begin shipping samples of a new 16W-average-power GaN power amplifier module (PAM) for ...

Researchers from Singapore’s Nanyang Technological University and its Agency for Science, Technology and Research are ...

Navitas Semiconductor has announced what it believes are the world’s first production-released 650 V bi-directional GaNFast ...

Compound Semiconductor™ is an Angel Business Communications publication.

Boise State University has qualified a new Aixtron 2D Close Coupled Showerhead MOCVD system for multi-wafer growth of wide ...

Innovative companies often have a rich history. Founded by Ernst Leybold in Cologne in 1850, the German vacuum specialist ...