In this work, a concept for the detection of defects in the solder layer between a power semiconductor and the printed circuit board is proposed. Four temperature sensors in the form of discrete ...

If PCBs aren’t tested, errors and defects missed during the manufacturing process could eventually lead to malfunctions and product failures in the field. After a PCB board is manufactured and ...

Adhesion of underfill to passivation layer on integrated circuit chip and solder mask layer on printed circuit board is critical to the reliability of an underfilled flip chip package. In this study, ...