With small geometry silicon processes, additional nonfunctional geometric structures are required to maintain layer planarity during the chemical/mechanical polishing (CMP) phase of processing. The ...
Santa Cruz, Calif. — Every nanometer chip requires dummy metal fill to reduce topology variations caused by chemical mechanical polishing. Startup Blaze DFM Inc. this week will roll out technology ...
Santa Cruz, Calif. — Every nanometer chip requires dummy metal fill to reduce topology variations caused by chemical mechanical polishing. Startup Blaze DFM Inc. this week will roll out technology ...
Among the many steps involved with chip design, there is one known by the deceptively simple name of “fill.” Fill involves adding shapes or polygons to the design that are structural, not logical.
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