Advanced CMOS process technologies enable IC designers to deliver higher performing devices, but also increase the need for extra board-level ESD protection to ensure the reliability of the end ...

IC cores have shrunk significantly with ever-smaller process geometries, but the I/Os have basically been stuck at the same sizes since 0.5-micron CMOS. Now with new compact electrostatic discharge ...

Sofics, a semiconductor integrated circuit IP provider, has announced that its TakeCharge Electrostatic Discharge (ESD) solutions portfolio is now available for TSMC’s advanced 3nm process technology.

New process cuts die size, I/O and ESDNews from E-InSiteSarnoff, the company that pioneered CMOS process technology, has unveiled its TakeCharge! technology for IC design, which it claims reduces die ...

Electrostatic discharge (ESD) protection is critical at advanced nodes to safeguard designs against effects intensified by shrinking transistor dimensions and oxide layer thicknesses. On the other ...

Toshiba Corporation (TOKYO:6502) has developed an electrostatic discharge (ESD) protection device for analog power semiconductor application, fabricated with advanced 0.13μm process technology, that ...

This newest offering to Mechnano’s growing portfolio of electrostatic dissipative (ESD) material solutions for Additive Manufacturing (AM) is based on Jabil PK 5000 engineered powder combined with a D ...

Belgium, October 24, 2023 – Sofics bv (https://linktr.ee/sofics), a leading semiconductor integrated circuit IP provider announced that its TakeCharge® Electrostatic Discharge (ESD) solutions ...