The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.

Corpus Christi, Texas – TT Electronics' IRC Advanced Film Division has tucked a series of surface-mount resistor networks in ball-grid array packages. These high-density networks, designated the CHC ...

Have you ever wondered how to eliminate internal delamination inside your semiconductor package, or how to reduce warpage of your large ball-grid array (BGA) package to eliminate non-wets during board ...

The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters ...